sps
-
- Category :
Catalyst and Auxiliary/Surface Active Agent
- CAS NO : 27206-35-5
- EC NO : 248-324-3
- Molecular Formula : C6H14O6S4·2Na
- Main Specifications : Assay: min 95% (HLPC)
- Synonyms : 3,3'-Dithiobis-1-Propanesulfonic Acid Disodium Salt Liquemin Liquoid;Sps;Bis-(Sodium Sulfopropyl)-Disulfode;Disodium 3,3'-Disulfanediyldipropane-1-Sulfonate;Benzene, 1-Methoxy-4-[(1e)-1-Propenyl]-, Sodium Salt;1-Propanesulfonic Acid, 3,3'-Dithiobis-, Sodium Salt (1:2);3,3'-Dithiobis(1-Propanesulfonic Acid), Disodium Salt;Di(Thiopropane Sodium Sulfonate);Gamma,Gamma'-Sulfopropyldisulfide, Disodium Salt;1-Propanesulfonic Acid, 3,3'-Dithiobis-, Disodium Salt;Disodium 3,3'-Dithiobis(1-Propanesulfonate);Bis-(3-Sulfopropyl)-Disulfide, Disodium Salt;Bis-(Sodium Sulfopropyl)-Disulfide;Disodium 3,3'-Dithiobis(Propanesulphonate);
Package: 25kg fiber can
Uses : copper plating intermidate
Molecular Structure:
Product description:
chemical name:Bis-(sodium sulfopropyl)-disulfide
Molecular formula:C6H12Na2O6S
cas no:27206-35-5
1) Product Features:
Products that not contain inorganic sulfide and sulfite, copper sulfate does not increase turbidity, scientific analysis, product quality and stability.
2) Quality Standards: Q/LZ 30-2008
Appearance: Colorless or yellowish powder
Assay: min 95% (HLPC)
Concentration in the bath: 20-100mg/L
Solubility: 38% water solution(Slightly soluble in alcohol)
3) Application
SPS for acid copper plating, decorative and functional availability coating (such as: printed circuit board). SPS can be a typical copper formulations, such as non-ionic surfactant, polyamine and other thiol compounds in combination, can also be used in conjunction with the dye, if combined with DPS and EXP2887 with, you will get better results.
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